Qualcomm Snapdragon 7c Plus Gen 3 vs Qualcomm Snapdragon 8 Gen 1. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU group
  Qualcomm Snapdragon 7c Plus Qualcomm Snapdragon 8 Gen 1
• Segment
  Mobile Mobile
• Generation
  3 1
• Predecessor
  Qualcomm Snapdragon 7c Gen 2 Qualcomm Snapdragon 888

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x Cortex-X2
• B-Core
  4x Cortex-A55 3x Cortex-A710
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Unknown Qualcomm Adreno 730
• GPU frequency
  0.70 GHz 0.84 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  0 --
• Shader
  0 --
• Max. displays
  0 --
• Generation
  7
• Direct X
  -- 12.1
• Technology
  4 nm
• Release date
  Q1/2022

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 8 Gen 1 and Qualcomm Snapdragon 7c Plus Gen 3. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-4266LPDDR5-6400 LPDDR5-3200
• Max. Memory
  16 GB
• Memory channels
  2 4
• ECC
  No No
• PCIe
  --
• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 7c Plus Gen 3 and Qualcomm Snapdragon 8 Gen 1 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 and Qualcomm Snapdragon 7c Plus Gen 3, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• ISA extensions
  --
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 Kryo
• Technology
  6 nm 4 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q1/2022 Q1/2022
• Part Number
  -- SM8450