Qualcomm Snapdragon 778G Plus vs Intel Core i7-12700KF. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Intel Core i7
• CPU group
  Qualcomm Snapdragon 778 Intel Core i 12000
• Segment
  Mobile Desktop / Server
• Generation
  4 12
• Predecessor
  -- Intel Core i7-11700KF

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  No Yes

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 642L Intel Iris Xe Graphics 32 (Alder Lake S)
• GPU frequency
  0.40 GHz
• GPU (Turbo)
  No turbo 1.45 GHz
• Execution units
  4 32
• Shader
  384 256
• Max. GPU Memory
  4 GB 16 GB
• Max. displays
  1 4
• Generation
  5 12
• Technology
  6 nm 10 nm
• Release date
  Q2/2021 Q4/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i7-12700KF and Qualcomm Snapdragon 778G Plus. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5-3200 DDR4-3200DDR5-4800
• Max. Memory
  16 GB 256 GB
• Memory channels
  2 2
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 778G Plus and Intel Core i7-12700KF to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  125 W
• TDP (PL2)
  -- 228 W / 56 s
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 778G Plus and Qualcomm Snapdragon 778G Plus, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.1, SSE4.2, AVX2, AVX2+
• L2-Cache
  -- 2.50 MB
• L3-Cache
  2.00 MB 25.00 MB
• Architecture
  Kryo 670 Alder Lake S
• Technology
  6 nm 10 nm
• Virtualization
  None VT-x, VT-x EPT, VT-d
• Socket
  N/A LGA 1700
• Release date
  Q4/2021 Q4/2021
• Part Number
  SM7325-AE BX8071512700K