Qualcomm Snapdragon 750G vs Intel Core i7-9700. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 750 Intel Core i 9000
• Family
  Qualcomm Snapdragon Intel Core i7
• Generation
  3 9
• Predecessor
  - Intel Core i7-8700
• Segment
  Mobile Desktop / Server
• Successor
  - Intel Core i7-10700

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Kryo 570 Gold -
• B-Core
  6x Kryo 570 Silver -
• Base Frequency
  1.8 GHz 3 GHz
• Core architecture
  hybrid (big.LITTLE) normal
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.2 GHz 4.7 GHz
• Turbo Frequency (8 Cores)
  2.2 GHz 3.8 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12.1 12
• Execution units
  0 24
• Generation
  6 9.5
• GPU Frequency
  950 MHz 350 MHz
• GPU name
  Qualcomm Adreno 619 Intel UHD Graphics 630
• GPU Turbo
  No turbo 1200 MHz
• Max. displays
  2 3
• Max. GPU Memory
  4 GB 64 GB
• Release date
  Q2/2020 Q4/2017
• Shader
  128 192
• Technology
  8 nm 14 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode | Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i7-9700 and Qualcomm Snapdragon 750G. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  8 GB 128 GB
• Memory channels
  2 2
• Memory type
  LPDDR4X-2133 DDR4-2666
• PCIe lanes
  - 16
• PCIe version
  - 3.0

• AES-NI
  No Yes

Compare the TDP requirements of TDP Qualcomm Snapdragon 750G and Intel Core i7-9700 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• Maximum Operating Temperature
  - 100 °C
• TDP (PL1, legacy label)
  - 65 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 750G and Intel Core i7-9700, virtual machine technologies and process technology.

• Architecture
  Kryo 570 Coffee Lake S Refresh
• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  - SSE4.1, SSE4.2, AVX2
• L3-Cache
  - 12 MB
• Part Number
  SM7225 -
• Release date
  Q4/2020 Q2/2019
• Socket
  - LGA 1151-2
• Technology
  8 nm 14 nm
• Virtualization
  None VT-x, VT-x EPT, VT-d