Qualcomm Snapdragon 680 4G
HiSilicon Kirin 970
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Qualcomm Snapdragon 680 4G vs HiSilicon Kirin 970. Specifications, performance, tests

Overall score
star star star star star
Released
Q1/2022
Qualcomm Snapdragon 680 4G
Qualcomm Snapdragon 680 4G
Released
Q3/2017
Overall score
star star star star star
HiSilicon Kirin 970
HiSilicon Kirin 970

What's the best choice Qualcomm Snapdragon 680 4G or HiSilicon Kirin 970? Which processor is faster?

We have prepared a comparison to help you choose the best processor. Compare their specifications and benchmarks.

Qualcomm Snapdragon 680 4G has a maximum frequency of 2.40 GHz. 8 / 8 Cores. Released in Q1/2022.

HiSilicon Kirin 970 has a maximum frequency of 1.84 GHz. 8 Cores. Power consumption of 9 W. Released in Q3/2017.

Differences

  • Place in the overall ranking

    (based on several benchmarks)

    1559 left arrow score
  • Higher clock speed

    Around 23% better clock speed

    2.40 GHz left arrow 1.84 GHz

Positions in all rankings

Common positions Qualcomm Snapdragon 680 4G CPU in popular benchmarks, for comparison with other models.

  • Geekbench 5, 64bit (Single-Core)
    1249 place
  • Geekbench 5, 64bit (Multi-Core)
    1075 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1195 place
  • Geekbench 6 (Single-Core)
    278 place
  • Place in the overall ranking

    (based on several benchmarks)

    1747 left arrow score

Positions in all rankings

Common positions HiSilicon Kirin 970 CPU in popular benchmarks, for comparison with other models.

  • Geekbench 5, 64bit (Single-Core)
    1309 place
  • Geekbench 5, 64bit (Multi-Core)
    1118 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1105 place

Specifications

Technical data
Qualcomm Snapdragon 680 4G Qualcomm Snapdragon 680 4G
HiSilicon Kirin 970 HiSilicon Kirin 970
CPU family and group

Background information about the processors being compared, series, generation and market segment.

  • Family
    Qualcomm Snapdragon left arrow HiSilicon Kirin
  • CPU group
    Qualcomm Snapdragon 680 left arrow HiSilicon Kirin 970
  • Segment
    Mobile left arrow Mobile
  • Generation
    6 left arrow 6
CPU Technical specs

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

  • Core architecture
    hybrid (big.LITTLE) left arrow hybrid (big.LITTLE)
  • Overclocking
    No left arrow No
IGPU

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

  • GPU name
    Qualcomm Adreno 610 left arrow ARM Mali-G72 MP12
  • GPU frequency
    left arrow 0.75 GHz
  • GPU (Turbo)
    No turbo left arrow No turbo
  • Execution units
    0 left arrow 12
  • Shader
    128 left arrow 192
  • Max. GPU Memory
    4 GB left arrow 2 GB
  • Max. displays
    0 left arrow 1
  • Generation
    6 left arrow Bifrost 2
  • Technology
    11 nm left arrow 16 nm
  • Release date
    Q2/2019 left arrow Q3/2017
Hardware codec support

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

  • h265 / HEVC (8 bit)
    Decode left arrow Decode / Encode
  • h265 / HEVC (10 bit)
    Decode left arrow Decode / Encode
  • h264
    Decode / Encode left arrow Decode / Encode
  • VP8
    Decode left arrow Decode / Encode
  • VP9
    Decode left arrow Decode / Encode
  • AV1
    No left arrow No
  • AVC
    Decode left arrow Decode / Encode
  • VC-1
    Decode left arrow Decode / Encode
  • JPEG
    Decode / Encode left arrow Decode / Encode
Memory specs & PCI

Types, channel quantity of RAM supported by HiSilicon Kirin 970 and Qualcomm Snapdragon 680 4G. Depending on the motherboards, higher or lower memory frequencies may be supported.

  • Memory type
    LPDDR4X-2133 left arrow LPDDR4X-2133
  • Max. Memory
    4 GB left arrow 8 GB
  • Memory channels
    2 left arrow 4
  • ECC
    No left arrow No
Thermal Management

Compare the TDP requirements of TDP Qualcomm Snapdragon 680 4G and HiSilicon Kirin 970 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

  • TDP (PL1)
    left arrow 9 W
Technologies and extensions

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 680 4G and Qualcomm Snapdragon 680 4G, virtual machine technologies and process technology.

  • Instruction set (ISA)
    ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
  • L3-Cache
    -- left arrow 2.00 MB
  • Architecture
    Kryo 265 left arrow Cortex-A73 / Cortex-A53
  • Technology
    6 nm left arrow 10 nm
  • Virtualization
    None left arrow None
  • Socket
    N/A left arrow N/A
  • Release date
    Q1/2022 left arrow Q3/2017
  • Part Number
    SM6225 left arrow --

Benchmarks

Performance tests CPUs

Based on the results of several benchmarks, you can more accurately estimate the difference in performance between Qualcomm Snapdragon 680 4G and HiSilicon Kirin 970.

Compare the synthetic test values and choose the best processor!

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively
388
Qualcomm Snapdragon 680 4G
349
HiSilicon Kirin 970
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively
1550
Qualcomm Snapdragon 680 4G
1455
HiSilicon Kirin 970
iGPU - FP32 Performance (Single-precision GFLOPS)
The performance of the iGPU - the internal GPU in games
273
Qualcomm Snapdragon 680 4G
330
HiSilicon Kirin 970

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