MediaTek Helio G88 vs Qualcomm Snapdragon 845. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Helio Qualcomm Snapdragon
• Generation
  1 5
• CPU group
  MediaTek Helio G70/G80 Qualcomm Snapdragon 845

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 1.80 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.00 GHz 2.80 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.80 GHz 2.80 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A75 4x Kryo 385 Gold
• B core
  6x Cortex-A55 4x Kryo 385 Silver

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G52 MP2 Qualcomm Adreno 630
• GPU frequency
  1.00 GHz 0.70 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  2 0
• Shader
  32 256
• Max. GPU Memory
  -- 8 GB
• Max. displays
  2 2
• Generation
  Bifrost 2 4
• DirectX Version
  12 11
• Technology
  16 nm 10 nm
• Release date
  Q3/2020 Q1/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 845 and MediaTek Helio G88. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-1800 LPDDR4X-1866
• Max. Memory
  8 GB 8 GB
• ECC
  No No
• Memory channels
  2 4
• PCIe version
  --
• PCIe lanes
  --

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Helio G88 and Qualcomm Snapdragon 845 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Architecture, interfaces, additional instructions supported by MediaTek Helio G88 and MediaTek Helio G88, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• ISA extensions
  --
• L2-Cache
  -- 0.51 MB
• L3-Cache
  -- 2.00 MB
• Architecture
  Cortex-A75 / Cortex-A55 Kryo 385
• Technology
  12 nm 10 nm
• Socket
  N/A N/A
• Release date
  Q2/2020 Q1/2018
• Part Number
  MT6769Z SDM845