MediaTek Dimensity 700 vs Qualcomm Snapdragon 410. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  MediaTek Dimensity 700/720/800 Qualcomm Snapdragon 410
• Family
  Mediatek Dimensity Qualcomm Snapdragon
• Generation
  1 2
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A76 -
• B-Core
  6x Cortex-A55 -
• Base Frequency
  2 GHz 1.2 GHz
• Core architecture
  hybrid (big.LITTLE) normal
• CPU Cores
  8 4
• CPU Threads
  8 4
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.2 GHz 1.2 GHz
• Turbo Frequency (8 Cores)
  2 GHz -
• Turbo Frequency (4 Cores)
  - 1.2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 11
• Execution units
  2 0
• Generation
  Vallhall 1 3
• GPU Frequency
  850 MHz 400 MHz
• GPU name
  ARM Mali-G57 MP2 Qualcomm Adreno 306
• GPU Turbo
  No turbo 400 MHz
• Max. displays
  2 0
• Max. GPU Memory
  4 GB -
• Release date
  Q2/2020 Q3/2012
• Shader
  32 24
• Technology
  7 nm 28 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  Decode No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode / Encode | No
• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode No
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No

Types, channel quantity of RAM supported by Qualcomm Snapdragon 410 and MediaTek Dimensity 700. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  12 GB -
• Memory channels
  2 1
• Memory type
  LPDDR4X-2133 LPDDR2-533LPDDR3-533

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 700 and Qualcomm Snapdragon 410 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 700 and Qualcomm Snapdragon 410, virtual machine technologies and process technology.

• Architecture
  Cortex-A76 / Cortex-A55 Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Part Number
  MT6833V/ZA APQ8016
• Release date
  Q1/2021 2014
• Technology
  7 nm 28 nm
• Virtualization
  None None