HiSilicon Kirin 960 vs Samsung Exynos 7880. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 960 Samsung Exynos 7570/7870/7880
• Family
  HiSilicon Kirin Samsung Exynos
• Generation
  5 1
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A73 -
• B-Core
  4x Cortex-A53 -
• Base Frequency
  1.8 GHz 1.9 GHz
• Core architecture
  hybrid (big.LITTLE) normal
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.4 GHz 1.9 GHz
• Turbo Frequency (8 Cores)
  2.4 GHz 1.9 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 11
• Execution units
  8 3
• Generation
  Bifrost 1 Midgard 4
• GPU Frequency
  900 MHz 600 MHz
• GPU name
  ARM Mali-G71 MP8 ARM Mali-T830 MP3
• GPU Turbo
  No turbo 600 MHz
• Max. displays
  2 2
• Max. GPU Memory
  2 GB -
• Release date
  Q2/2016 Q4/2015
• Shader
  256 48
• Technology
  16 nm 28nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode / Encode | No
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  No No
• VP8
  Decode / Encode Decode / Encode
• VP9
  No No

Types, channel quantity of RAM supported by Samsung Exynos 7880 and HiSilicon Kirin 960. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  6 GB -
• Memory channels
  2 0
• Memory type
  LPDDR4-1600 LPDDR4-1600

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 960 and Samsung Exynos 7880 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  5 W -

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 960 and Samsung Exynos 7880, virtual machine technologies and process technology.

• Architecture
  Cortex-A73 / Cortex-A53 Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  - 2 MB
• L3-Cache
  4 MB -
• Release date
  Q4/2016 Q1/2017
• Technology
  16 nm 14 nm
• Virtualization
  None None