HiSilicon Kirin 659 vs HiSilicon Kirin 655. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 650 HiSilicon Kirin 650
• Family
  HiSilicon Kirin HiSilicon Kirin
• Generation
  4 4
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A53 4x Cortex-A53
• B-Core
  4x Cortex-A53 4x Cortex-A53
• Base Frequency
  1.7 GHz 1.7 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.36 GHz 2.12 GHz
• Turbo Frequency (8 Cores)
  2.36 GHz 2.12 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 11
• Execution units
  2 2
• Generation
  Midgard 4 Midgard 4
• GPU Frequency
  900 MHz 900 MHz
• GPU name
  ARM Mali-T830 MP2 ARM Mali-T830 MP2
• GPU Turbo
  900 MHz 900 MHz
• Max. displays
  2 2
• Release date
  Q4/2015 Q4/2015
• Shader
  32 32
• Technology
  28nm 28nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode / Encode | No Conflicting source values: Decode / Encode | No
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  No No
• VP8
  Decode / Encode Decode / Encode
• VP9
  No No

Types, channel quantity of RAM supported by HiSilicon Kirin 655 and HiSilicon Kirin 659. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Memory channels
  2 2
• Memory type
  LPDDR3-933 LPDDR3-933

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 659 and HiSilicon Kirin 655 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 659 and HiSilicon Kirin 655, virtual machine technologies and process technology.

• Architecture
  Cortex-A53 / Cortex-A53 Cortex-A53 / Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Release date
  Q2/2016 Q2/2016
• Technology
  16 nm 16 nm
• Virtualization
  None None