HiSilicon Kirin 655 vs MediaTek Dimensity 1080. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 650 MediaTek Dimensity 10xx
• Family
  HiSilicon Kirin Mediatek Dimensity
• Generation
  4 2
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A53 2x Cortex-A78
• B-Core
  4x Cortex-A53 6x Cortex-A55
• Base Frequency
  1.7 GHz -
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.12 GHz -
• Turbo Frequency (8 Cores)
  2.12 GHz -
• A-Core Frequency
  - 2.6 GHz
• B-Core Frequency
  - 2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 12
• Execution units
  2 4
• Generation
  Midgard 4 Vallhall 2
• GPU Frequency
  900 MHz -
• GPU name
  ARM Mali-T830 MP2 ARM Mali-G68 MP4
• GPU Turbo
  900 MHz No turbo
• Max. displays
  2 1
• Release date
  Q4/2015 Q2/2020
• Shader
  32 64
• Technology
  28nm 6 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  Conflicting source values: Decode / Encode | No Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  No Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  No Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 1080 and HiSilicon Kirin 655. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Memory channels
  2 0
• Memory type
  LPDDR3-933 LPDDR4XLPDDR5

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 655 and MediaTek Dimensity 1080 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 655 and MediaTek Dimensity 1080, virtual machine technologies and process technology.

• Architecture
  Cortex-A53 / Cortex-A53 Cortex-A78 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Part Number
  - MT6877V/TTZA
• Release date
  Q2/2016 Q4/2022
• Technology
  16 nm 6 nm
• Virtualization
  None None
• Chip design
  - Chiplet
• Documents
  - Technical data sheet
• Operating systems
  - Android