AMD Ryzen Embedded R2314 vs Intel Core i5-12600K. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  AMD Ryzen Embedded Intel Core i5
• CPU group
  AMD Ryzen Embedded R2000 Intel Core i 12000
• Segment
  Desktop / Server Desktop / Server
• Generation
  2 12
• Predecessor
  -- Intel Core i5-11600K

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  normal hybrid (big.LITTLE)
• Overclocking
  No Yes
• Frequency
  2.10 GHz 3.70 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  AMD Radeon Vega 6 Graphics Intel Iris Xe Graphics 32 (Alder Lake S)
• GPU frequency
  1.20 GHz 0.40 GHz
• GPU (Turbo)
  No turbo 1.45 GHz
• Execution units
  6 32
• Shader
  384 256
• Max. GPU Memory
  2 GB 16 GB
• Max. displays
  3 4
• Generation
  8 12
• Technology
  14 nm 10 nm
• Release date
  Q1/2018 Q4/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode / Encode
• AV1
  No Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i5-12600K and AMD Ryzen Embedded R2314. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR4-2666 DDR4-3200DDR5-4800
• Max. Memory
  32 GB 256 GB
• Memory channels
  2 2
• ECC
  Yes No

Compare the TDP requirements of TDP AMD Ryzen Embedded R2314 and Intel Core i5-12600K to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 125 W
• TDP (PL2)
  -- 228 W / 56 s
• TDP up
  35 W --
• TDP down
  12 W --
• Tjunction max.
  105 °C 100 °C

Architecture, interfaces, additional instructions supported by AMD Ryzen Embedded R2314 and AMD Ryzen Embedded R2314, virtual machine technologies and process technology.

• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.1, SSE4.2, AVX2, AVX2+
• L2-Cache
  2.00 MB --
• L3-Cache
  4.00 MB 20.00 MB
• Architecture
  Zen+ Alder Lake S
• Technology
  12 nm 10 nm
• Virtualization
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Socket
  FP5 LGA 1700
• Release date
  Q2/2022 Q4/2021
• Part Number
  -- BX8071512600K