UNISOC T606 vs Qualcomm Snapdragon 8 Gen 1. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  UNISOC 4G Qualcomm Snapdragon
• CPU group
  UNISOC 4G 12nm Qualcomm Snapdragon 8 Gen 1
• Segment
  Mobile Mobile
• Generation
  0 1
• Predecessor
  -- Qualcomm Snapdragon 888

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  2x Cortex-A75 1x Cortex-X2
• B-Core
  6x Cortex-A55 3x Cortex-A710
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G57 MP1 Qualcomm Adreno 730
• GPU frequency
  0.65 GHz 0.84 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  2 --
• Shader
  32 --
• Max. GPU Memory
  4 GB --
• Max. displays
  2 --
• Generation
  Vallhall 1 7
• Direct X
  12 12.1
• Technology
  7 nm 4 nm
• Release date
  Q2/2020 Q1/2022

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 8 Gen 1 and UNISOC T606. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-1600 LPDDR5-3200
• Max. Memory
  16 GB
• Memory channels
  0 4
• ECC
  No No
• PCIe
  --
• AES-NI
  No No

Compare the TDP requirements of TDP UNISOC T606 and Qualcomm Snapdragon 8 Gen 1 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by UNISOC T606 and UNISOC T606, virtual machine technologies and process technology.

• Technology
  12 nm 4 nm
• Socket
  -- N/A
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architecture
  Kryo
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• ISA extensions
  --
• Release date
  Q3/2021 Q1/2022
• Part Number
  -- SM8450