Qualcomm Snapdragon 860 vs MediaTek Helio G95. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 855/860 MediaTek Helio G90
• Family
  Qualcomm Snapdragon Mediatek Helio
• Generation
  6 1
• Predecessor
  Qualcomm Snapdragon 855+ -
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  1x Kryo 485 Prime 2x Cortex-A76
• B-Core
  3x Kryo 485 Gold 6x Cortex-A55
• Base Frequency
  1.8 GHz 2 GHz
• C-Core
  4x Kryo 485 Silver -
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.96 GHz 2.05 GHz
• Turbo Frequency (8 Cores)
  2.42 GHz 2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12.0 12
• Execution units
  4 4
• Generation
  5 Bifrost 3
• GPU Frequency
  250 MHz 900 MHz
• GPU name
  Qualcomm Adreno 640 ARM Mali-G76 MP4
• GPU Turbo
  680 MHz No turbo
• Max. displays
  1 2
• Max. GPU Memory
  4 GB 4 GB
• Release date
  Q1/2019 Q3/2018
• Shader
  384 64
• Technology
  7 nm 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode / Encode | No Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  No Decode / Encode
• VC-1
  No Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Helio G95 and Qualcomm Snapdragon 860. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  16 GB 10 GB
• Memory channels
  4 2
• Memory type
  LPDDR4X-2133 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 860 and MediaTek Helio G95 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 860 and MediaTek Helio G95, virtual machine technologies and process technology.

• Architecture
  Kryo 485 Cortex-A76 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2 MB -
• L3-Cache
  3 MB -
• Part Number
  SM8150-AC MT6785V/CD
• Release date
  Q1/2021 Q3/2019
• Technology
  7 nm 12 nm
• Virtualization
  None None