Qualcomm Snapdragon 845 vs Intel Core i5-3570K. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Desktop / Server
• Family
  Qualcomm Snapdragon Intel Core i5
• Generation
  5 3
• CPU group
  Qualcomm Snapdragon 845 Intel Core i 3000

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 3.40 GHz
• CPU Cores
  8 4
• Turbo (1 Core)
  2.80 GHz 3.80 GHz
• CPU Threads
  8 4
• Hyperthreading
  No No
• Overclocking
  No Yes
• Core architecture
  hybrid (big.LITTLE) normal
• A core
  4x Kryo 385 Gold --
• B core
  4x Kryo 385 Silver --

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 630 Intel HD Graphics 4000
• GPU frequency
  0.70 GHz 0.65 GHz
• GPU (Turbo)
  No turbo 1.15 GHz
• Execution units
  0 16
• Shader
  256 128
• Max. GPU Memory
  8 GB --
• Max. displays
  2 3
• Generation
  4 7
• DirectX Version
  11 11.0
• Technology
  10 nm 22 nm
• Release date
  Q1/2018 Q1/2011

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode No
• h265 / HEVC (10 bit)
  Decode No
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode No
• VP8
  Decode No
• AV1
  No No
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode

Types, channel quantity of RAM supported by Intel Core i5-3570K and Qualcomm Snapdragon 845. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-1866 DDR3-1600
• Max. Memory
  8 GB 32 GB
• ECC
  No No
• Memory channels
  4 2
• PCIe version
  3.0
• PCIe lanes
  16

• AES-NI
  No Yes

Compare the TDP requirements of TDP Qualcomm Snapdragon 845 and Intel Core i5-3570K to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  77 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 845 and Qualcomm Snapdragon 845, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• Virtualization
  None VT-x, VT-x EPT, VT-d
• ISA extensions
  SSE4.1, SSE4.2, AVX
• L2-Cache
  0.51 MB --
• L3-Cache
  2.00 MB 6.00 MB
• Architecture
  Kryo 385 Ivy Bridge S
• Technology
  10 nm 22 nm
• Socket
  N/A LGA 1155
• Release date
  Q1/2018 Q2/2012
• Part Number
  SDM845 --