Qualcomm Snapdragon 730G vs MediaTek Dimensity 1000C. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Mediatek Dimensity
• CPU group
  Qualcomm Snapdragon 730 MediaTek Dimensity 1000
• Segment
  Mobile Mobile
• Generation
  2 1

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequency
  1.80 GHz 2.00 GHz
• Turbo (1 Core)
  2.20 GHz 2.00 GHz
• Turbo (8 Cores)
  2.20 GHz 2.00 GHz
• Hyperthreading
  No No
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 618 ARM Mali-G57 MP5
• GPU frequency
  0.83 GHz 0.95 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  0 5
• Shader
  128 80
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  6 Vallhall 1
• Technology
  14 nm 7 nm
• Release date
  Q2/2019 Q2/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 1000C and Qualcomm Snapdragon 730G. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-1866 LPDDR4X-1866
• Max. Memory
  8 GB 12 GB
• Memory channels
  2 4
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 730G and MediaTek Dimensity 1000C to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 730G and Qualcomm Snapdragon 730G, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architecture
  Kryo 470 Gold/475 Silver Cortex-A77 / Cortex-A55
• Technology
  8 nm 7 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q2/2019 Q3/2020
• Part Number
  SM7150-AB MT6883Z/CZA