Qualcomm Snapdragon 650 vs HiSilicon Kirin 659. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 650 HiSilicon Kirin 650
• Family
  Qualcomm Snapdragon HiSilicon Kirin
• Generation
  4 4
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A72 4x Cortex-A53
• B-Core
  4x Cortex-A53 4x Cortex-A53
• Base Frequency
  1.4 GHz 1.7 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  6 8
• CPU Threads
  6 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  1.8 GHz 2.36 GHz
• Turbo Frequency (6 Cores)
  1.4 GHz -
• Turbo Frequency (8 Cores)
  - 2.36 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 11
• Execution units
  0 2
• Generation
  5 Midgard 4
• GPU Frequency
  600 MHz 900 MHz
• GPU name
  Qualcomm Adreno 510 ARM Mali-T830 MP2
• GPU Turbo
  600 MHz 900 MHz
• Max. displays
  0 2
• Release date
  Q4/2015 Q4/2015
• Shader
  128 32
• Technology
  14 nm 28nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode | No Conflicting source values: Decode / Encode | No
• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• JPEG
  Decode Decode / Encode
• VC-1
  Decode No
• VP8
  Decode Decode / Encode
• VP9
  Decode No

Types, channel quantity of RAM supported by HiSilicon Kirin 659 and Qualcomm Snapdragon 650. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Memory channels
  2 2
• Memory type
  LPDDR3-933 LPDDR3-933

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 650 and HiSilicon Kirin 659 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 650 and HiSilicon Kirin 659, virtual machine technologies and process technology.

• Architecture
  Cortex-A72 / Cortex-A53 Cortex-A53 / Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Part Number
  MSM8956 -
• Release date
  Q1/2016 Q2/2016
• Technology
  28 nm 16 nm
• Virtualization
  None None