Qualcomm Snapdragon 615 vs MediaTek Helio G90. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Mediatek Helio
• CPU group
  Qualcomm Snapdragon 610 MediaTek Helio G90
• Segment
  Mobile Mobile
• Generation
  2 1

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequency
  1.00 GHz 2.00 GHz
• Turbo (1 Core)
  1.50 GHz 2.05 GHz
• Turbo (8 Cores)
  1.00 GHz 2.00 GHz
• Hyperthreading
  No No
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 405 ARM Mali-G76 MP4
• GPU frequency
  0.55 GHz 0.72 GHz
• GPU (Turbo)
  0.55 GHz No turbo
• Execution units
  0 4
• Shader
  48 64
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 2
• Generation
  4 Bifrost 3
• Technology
  28 nm 7 nm
• Release date
  Q1/2014 Q3/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Helio G90 and Qualcomm Snapdragon 615. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-800 LPDDR4X-2133
• Max. Memory
  10 GB
• Memory channels
  1 2
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 615 and MediaTek Helio G90 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 615 and Qualcomm Snapdragon 615, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA extensions
  --
• Architecture
  Cortex-A53 Cortex-A76 / Cortex-A55
• Technology
  28 nm 12 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q3/2014 Q3/2019
• Part Number
  MSM8939 MT6785V/CD