Qualcomm Snapdragon 460 vs Qualcomm Snapdragon 662. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Qualcomm Snapdragon
• Generation
  5 7
• CPU group
  Qualcomm Snapdragon 460 Qualcomm Snapdragon 662/665

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 1.80 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  1.80 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.80 GHz 1.80 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Kryo 240 Gold 4x Kryo 260 Gold
• B core
  4x Kryo 240 Silver 4x Kryo 260 Silver

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 610 Qualcomm Adreno 610
• GPU (Turbo)
  No turbo No turbo
• Shader
  128 128
• Max. GPU Memory
  4 GB 4 GB
• Generation
  6 6
• DirectX Version
  12.1 12.1
• Technology
  11 nm 11 nm
• Release date
  Q2/2019 Q2/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  No No
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 662 and Qualcomm Snapdragon 460. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-933LPDDR4X-1866 LPDDR3-933LPDDR4X-1866
• ECC
  No No
• Memory channels
  1 2

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 460 and Qualcomm Snapdragon 662 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 460 and Qualcomm Snapdragon 460, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Kryo 240 Kryo 260
• Technology
  11 nm 11 nm
• Socket
  N/A N/A
• Release date
  Q1/2020 Q1/2020
• Part Number
  SM4250-AA SM6115