MediaTek Helio G35 vs Qualcomm Snapdragon 665. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Helio Qualcomm Snapdragon
• Generation
  1 7
• CPU group
  MediaTek Helio G25/G35 Qualcomm Snapdragon 662/665

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 1.80 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.30 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.80 GHz 1.80 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 4x Kryo 260 Gold
• B core
  4x Cortex-A53 4x Kryo 260 Silver

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  PowerVR GE8320 Qualcomm Adreno 610
• GPU frequency
  0.68 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  1 0
• Shader
  -- 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 0
• Generation
  -- 6
• DirectX Version
  10 12.1
• Technology
  20 nm 11 nm
• Release date
  Q1/2017 Q2/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode
• h265 / HEVC (10 bit)
  No Decode
• h264
  No Decode / Encode
• VP9
  No Decode
• VP8
  No Decode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 665 and MediaTek Helio G35. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-933LPDDR4-1600 LPDDR3-1866LPDDR4X-1866
• Max. Memory
  6 GB
• ECC
  No No
• Memory channels
  1 2
• PCIe version
  --
• PCIe lanes
  --

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Helio G35 and Qualcomm Snapdragon 665 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Architecture, interfaces, additional instructions supported by MediaTek Helio G35 and MediaTek Helio G35, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• ISA extensions
  --
• Architecture
  Cortex-A53 / Cortex-A53 Kryo 260
• Technology
  12 nm 11 nm
• Socket
  N/A N/A
• Release date
  Q2/2020 Q2/2019
• Part Number
  MT6765G SM6125