MediaTek Helio A22 vs Qualcomm Snapdragon 845. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  MediaTek Helio A22 Qualcomm Snapdragon 845
• Family
  Mediatek Helio Qualcomm Snapdragon
• Generation
  1 5
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• Base Frequency
  2 GHz 1.8 GHz
• Core architecture
  normal hybrid (big.LITTLE)
• Core Configuration
  4x Cortex-A53 -
• CPU Cores
  4 8
• CPU Threads
  4 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2 GHz 2.8 GHz
• Turbo Frequency (4 Cores)
  2 GHz -
• A-Core
  - 4x Kryo 385 Gold
• B-Core
  - 4x Kryo 385 Silver
• Turbo Frequency (8 Cores)
  - 2.8 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  10 11
• Execution units
  1 0
• Generation
  - 4
• GPU Frequency
  650 MHz 700 MHz
• GPU name
  PowerVR GE8300 Qualcomm Adreno 630
• GPU Turbo
  No turbo No turbo
• Max. displays
  1 2
• Max. GPU Memory
  - 8 GB
• Release date
  Q1/2017 Q1/2018
• Shader
  0 256
• Technology
  20 nm 10 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  No Conflicting source values: Decode | Decode / Encode
• h265 / HEVC (8 bit)
  No Decode
• h265 / HEVC (10 bit)
  No Decode
• JPEG
  No Decode / Encode
• VC-1
  No Decode
• VP8
  No Decode
• VP9
  No Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 845 and MediaTek Helio A22. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  3 GB 8 GB
• Memory channels
  1 4
• Memory type
  LPDDR4X-3200 LPDDR4X-1866

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Helio A22 and Qualcomm Snapdragon 845 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by MediaTek Helio A22 and Qualcomm Snapdragon 845, virtual machine technologies and process technology.

• Architecture
  Cortex-A53 / Cortex-A53 Kryo 385
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  - 0.51 MB
• L3-Cache
  - 2 MB
• Operating systems
  Android -
• Part Number
  - SDM845
• Release date
  Q2/2020 Q1/2018
• Technology
  16 nm 10 nm
• Virtualization
  None None