MediaTek Dimensity 9000 vs Qualcomm Snapdragon 7 Gen 1. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Mediatek Dimensity Qualcomm Snapdragon
• CPU group
  MediaTek Dimensity 9000 Qualcomm Snapdragon 7/8 Gen 1
• Segment
  Mobile Mobile
• Generation
  3 1

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 6 / 6
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  1x Cortex-X2 1x
• B-Core
  3x Cortex-A710 2x
• C-Core
  4x Cortex-A510 3x
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• A-Core Frequency
  1.80 GHz (3.05 GHz) 3.20 GHz
• B-Core Frequency
  2.85 GHz 2.60 GHz
• C-Core Frequency
  -- 1.80 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G710 MP10 no iGPU
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  10
• Max. displays
  1
• Generation
  Vallhall 3
• Direct X
  12 --
• Technology
  4 nm
• Release date
  Q2/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode No
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No
• AV1
  Decode No
• AVC
  Decode / Encode No
• VC-1
  Decode / Encode No
• JPEG
  Decode / Encode No

Types, channel quantity of RAM supported by Qualcomm Snapdragon 7 Gen 1 and MediaTek Dimensity 9000. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5-7500 LPDDR5-6400
• Max. Memory
  16 GB
• Memory channels
  4 4
• Bandwidth
  60.0 GB/s --
• ECC
  No No
• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 9000 and Qualcomm Snapdragon 7 Gen 1 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 9000 and MediaTek Dimensity 9000, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv9-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-X2 / -A710 / -A510 Cortex-X2 / -A710 / -A510
• Technology
  4 nm 4 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q1/2022 Q2/2022
• Part Number
  MT6983 SM8475
• Operating systems
  Android Android, Windows 10 (ARM)