MediaTek Dimensity 8000 vs Qualcomm Snapdragon 8 Gen 1. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Mediatek Dimensity Qualcomm Snapdragon
• CPU group
  MediaTek Dimensity 8000 Qualcomm Snapdragon 8 Gen 1
• Segment
  Mobile Mobile
• Generation
  3 1
• Predecessor
  -- Qualcomm Snapdragon 888

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x Cortex-X2
• B-Core
  4x Cortex-A55 3x Cortex-A710
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G610 MP6 Qualcomm Adreno 730
• GPU frequency
  0.84 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  6 --
• Shader
  0 --
• Max. displays
  1 --
• Generation
  Vallhall 3 7
• Direct X
  12 12.1
• Technology
  4 nm 4 nm
• Release date
  Q2/2021 Q1/2022

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 8 Gen 1 and MediaTek Dimensity 8000. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5-6400 LPDDR5-3200
• Max. Memory
  16 GB
• Memory channels
  4 4
• ECC
  No No
• PCIe
  --
• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 8000 and Qualcomm Snapdragon 8 Gen 1 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 8000 and MediaTek Dimensity 8000, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• ISA extensions
  --
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 Kryo
• Technology
  5 nm 4 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q1/2022 Q1/2022
• Part Number
  -- SM8450