Intel Core i7-4770K vs AMD Ryzen 9 5900HS Creator Edition. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Desktop / Server Mobile
• Family
  Intel Core i7 AMD Ryzen
• Generation
  4 4
• CPU group
  Intel Core i 4000 AMD Ryzen 5000H

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  3.50 GHz 3.30 GHz
• CPU Cores
  4 8
• Turbo (1 Core)
  3.90 GHz 4.60 GHz
• CPU Threads
  8 16
• Hyperthreading
  Yes Yes
• Overclocking
  Yes No
• Core architecture
  normal normal

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Intel HD Graphics 4600 AMD Radeon 8 Graphics (Renoir)
• GPU frequency
  0.35 GHz 1.90 GHz
• GPU (Turbo)
  1.25 GHz No turbo
• Execution units
  20 8
• Shader
  160 512
• Max. GPU Memory
  2 GB 2 GB
• Max. displays
  3 3
• Generation
  7.5 9
• DirectX Version
  11.1 12
• Technology
  22 nm 7 nm
• Release date
  Q2/2013 Q1/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No No
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode Decode / Encode

Types, channel quantity of RAM supported by AMD Ryzen 9 5900HS Creator Edition and Intel Core i7-4770K. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR3-1600 DDR4-3200LPDDR4-4266
• Max. Memory
  32 GB 64 GB
• ECC
  No No
• Memory channels
  2 2
• PCIe version
  3.0 3.0
• PCIe lanes
  16 12

• AES-NI
  Yes Yes

Compare the TDP requirements of TDP Intel Core i7-4770K and AMD Ryzen 9 5900HS Creator Edition to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  84 W 45 W
• TDP up
  -- 54 W
• TDP down
  -- 35 W
• Tjunction max.
  -- 105 °C

Architecture, interfaces, additional instructions supported by Intel Core i7-4770K and Intel Core i7-4770K, virtual machine technologies and process technology.

• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualization
  VT-x, VT-x EPT, VT-d AMD-V, SVM
• ISA extensions
  SSE4.1, SSE4.2, AVX2 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  -- 4.00 MB
• L3-Cache
  8.00 MB 16.00 MB
• Architecture
  Haswell S Cezanne (Zen 3)
• Technology
  22 nm 7 nm
• Socket
  LGA 1150 FP6
• Release date
  Q2/2013 Q3/2021