HiSilicon Kirin 820E 5G vs Qualcomm Snapdragon 8cx. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  6 3
• CPU group
  HiSilicon Kirin 810/820 Qualcomm Snapdragon 8cx

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.84 GHz 1.80 GHz
• Turbo (1 Core)
  2.22 GHz 2.84 GHz
• Turbo (8 Cores)
  1.84 GHz 2.84 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G57 MP6 Qualcomm Adreno 680
• GPU frequency
  0.85 GHz 0.25 GHz
• GPU (Turbo)
  No turbo 0.59 GHz
• Execution units
  6 8
• Shader
  96 768
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  Vallhall 1 5
• Technology
  7 nm 7 nm
• Release date
  Q2/2020 Q4/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 8cx and HiSilicon Kirin 820E 5G. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memory
  16 GB
• ECC
  No No
• Memory channels
  4 8

Compare the TDP requirements of TDP HiSilicon Kirin 820E 5G and Qualcomm Snapdragon 8cx to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W 7 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 820E 5G and HiSilicon Kirin 820E 5G, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  2.00 MB 2.00 MB
• Architecture
  Cortex-A76 / Cortex-A55 Kryo 495
• Technology
  7 nm 7 nm
• Socket
  N/A N/A
• Release date
  Q1/2021 Q4/2018