HiSilicon Kirin 658 vs Qualcomm Snapdragon 653. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  4 4
• CPU group
  HiSilicon Kirin 650 Qualcomm Snapdragon 650

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.70 GHz 1.44 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.35 GHz 1.95 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.35 GHz 1.44 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 4x Cortex-A72
• B core
  4x Cortex-A53 4x Cortex-A53

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-T830 MP2 Qualcomm Adreno 510
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  0.90 GHz 0.60 GHz
• Execution units
  2 0
• Shader
  32 128
• Max. displays
  2 0
• Generation
  Midgard 4 5
• DirectX Version
  11 11
• Technology
  28nm 14 nm
• Release date
  Q4/2015 Q4/2015

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode No
• h264
  Decode / Encode Decode
• VP9
  No Decode
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  No No
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 653 and HiSilicon Kirin 658. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-933 LPDDR3-933
• ECC
  No No
• Memory channels
  2 2

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 658 and Qualcomm Snapdragon 653 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 658 and HiSilicon Kirin 658, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A53 / Cortex-A53 Cortex-A72 / Cortex-A53
• Technology
  16 nm 28 nm
• Socket
  N/A N/A
• Release date
  Q2/2016 Q4/2016
• Part Number
  -- MSM8976 Pro