Apple M2 (8-GPU) vs Qualcomm Snapdragon 7 Gen 1. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Apple M series Qualcomm Snapdragon
• CPU group
  Apple M2 Qualcomm Snapdragon 7/8 Gen 1
• Segment
  Mobile Mobile
• Generation
  2 1
• Predecessor
  Apple M1 --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 6 / 6
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Avalanche 1x
• B-Core
  4x Blizzard 2x
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• A-Core Frequency
  3.50 GHz 3.20 GHz
• B-Core Frequency
  2.80 GHz 2.60 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Apple M2 (8 Core) no iGPU
• GPU frequency
  1.40 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  128
• Shader
  1024
• Max. GPU Memory
  24 GB --
• Max. displays
  2
• Generation
  2
• Technology
  5 nm
• Release date
  Q2/2022

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode No
• VP8
  Decode No
• VP9
  Decode / Encode No
• AV1
  No No
• AVC
  Decode No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Types, channel quantity of RAM supported by Qualcomm Snapdragon 7 Gen 1 and Apple M2 (8-GPU). Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5-6400 LPDDR5-6400
• Max. Memory
  24 GB 16 GB
• Memory channels
  2 (Dual Channel) 4
• Bandwidth
  102.4 GB/s --
• ECC
  No No
• PCIe
  4.0
• AES-NI
  Yes No

Compare the TDP requirements of TDP Apple M2 (8-GPU) and Qualcomm Snapdragon 7 Gen 1 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  22 W
• TDP down
  10 W --
• Tjunction max.
  100 °C --

Architecture, interfaces, additional instructions supported by Apple M2 (8-GPU) and Apple M2 (8-GPU), virtual machine technologies and process technology.

• Technology
  5 nm 4 nm
• Socket
  N/A N/A
• L2-Cache
  20.00 MB 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architecture
  M2 Cortex-X2 / -A710 / -A510
• Operating systems
  macOS, iPadOS Android, Windows 10 (ARM)
• Virtualization
  Apple Virtualization Framework None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• ISA extensions
  Rosetta 2 x86-Emulation
• Release date
  Q2/2022 Q2/2022
• Part Number
  -- SM8475
• Documents
  Technical data sheet --