Apple M1 vs Qualcomm Snapdragon 670. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Apple M series Qualcomm Snapdragon
• Generation
  1 6
• CPU group
  Apple M1 Qualcomm Snapdragon 670

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  3.20 GHz 1.70 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  No turbo 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  No turbo 1.70 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Firestorm 2x Kryo 360 Gold
• B core
  4x Icestorm 6x Kryo 360 Silver

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Apple M1 (8 Core) Qualcomm Adreno 615
• GPU frequency
  3.20 GHz 0.70 GHz
• GPU (Turbo)
  No turbo 0.70 GHz
• Execution units
  128 0
• Shader
  0 256
• Max. GPU Memory
  8 GB --
• Max. displays
  2 0
• Generation
  1 6
• DirectX Version
  12.1
• Technology
  5 nm 10 nm
• Release date
  Q4/2020 Q2/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode Decode
• VP8
  Decode Decode
• AV1
  Decode No
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 670 and Apple M1. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-4266 LPDDR4X-1866
• Max. Memory
  16 GB
• ECC
  No No
• Memory channels
  2 2
• PCIe version
  4.0

• AES-NI
  Yes No

Compare the TDP requirements of TDP Apple M1 and Qualcomm Snapdragon 670 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP up
  20 W --
• TDP down
  10 W --

Architecture, interfaces, additional instructions supported by Apple M1 and Apple M1, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• ISA extensions
  Rosetta 2 x86-Emulation
• L2-Cache
  16.00 MB --
• Architecture
  M1 Kryo 360
• Technology
  5 nm 10 nm
• Socket
  N/A N/A
• Release date
  Q4/2020 Q3/2018
• Part Number
  -- SDM670