Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 990 5G. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon HiSilicon Kirin
• Generation
  8 8
• CPU group
  Qualcomm Snapdragon 888 HiSilicon Kirin 990

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 1.95 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  3.00 GHz 2.36 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.42 GHz 2.86 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  1x Kryo 680 Prime 2x Cortex-A76
• B core
  3x Kryo 680 Gold 2x Cortex-A76
• C core
  4x Kryo 680 Silver 4x Cortex-A55

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 660 ARM Mali-G76 MP16
• GPU frequency
  0.84 GHz 0.60 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  0 16
• Shader
  0 256
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 2
• Generation
  6 Bifrost 3
• DirectX Version
  12.1 12
• Technology
  5 nm 7 nm
• Release date
  Q1/2021 Q3/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 990 5G and Qualcomm Snapdragon 888 Plus. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5-3200 LPDDR4X-4266
• Max. Memory
  8 GB
• ECC
  No No
• Memory channels
  4 4

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 888 Plus and HiSilicon Kirin 990 5G to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 888 Plus and Qualcomm Snapdragon 888 Plus, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L2-Cache
  4.00 MB --
• L3-Cache
  4.00 MB 2.00 MB
• Architecture
  Kryo 680 Cortex-A76 / Cortex-A55
• Technology
  5 nm 7 nm
• Socket
  N/A N/A
• Release date
  Q3/2021 Q3/2019
• Part Number
  SM8350-AC --